Associate Professor

2007/09-2012/06 Ph.D., Dept. of Precision Instruments & Mechanology, Tsinghua University, Beijing (Advisor: Prof. Xinchun Lu)

Thesis Topic: Research on Fluid Lubrication Behavior during Chemical Mechanical Polishing of 300mm Wafer

2003/09-2007/06 B.E., Dept. of Mechanical Engineering, Huazhong University of Science and Technology, Wuhan

2019/12-Present Associate Researcher, Dept. of Mechanical Engineering, Tsinghua University

2015/04-2019/12 Assistant Researcher, Dept. of Mechanical Engineering, Tsinghua University

2012/07-2015/04 Postdoctoral Fellow, Dept. of Precision Instruments and Mechanology, Tsinghua University

Chemical Mechanical Polishing

Nano Tribology

Ultra-Precision Processing Machine

2023 National Technological Invention Award: 1st Prize (ranked 4th)

2022 National Natural Science Award: 1st Prize (ranked 5th)

2022 Outstanding Science and Technology Worker of Tianjin

2019 Tianjin Technical Invention Award (ranked 2nd)

2019 China Machinery Industry Technology Invention Award: Special Prize (ranked 3rd)

2019 China Good Design: Gold Award (ranked 3rd)

2013 the 3rd HIWIN Outstanding Doctoral Dissertation Award in Mechanical Engineering: Bronze Award

More than 40 papers have been published and more than 100 patents have been granted.

SELECTED PUBLICATIONS

1. Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process, TRIBOLOGY INTERNATIONAL, 2023, 189.

2. Hongfe Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process, TRIBOLOGY INTERNATIONAL, 2022, 171.

3. Qinyang Zeng, Changkun Li, Dewen Zhao, Xinchun Lu, Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD, COMPUTATIONAL MATERIALS SCIENCE, 2022, 214.

4. Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2022, 222.

5. Yuanhang Liu, Hongfei Tao, Dewen Zhao, Xinchun Lu, An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process, MATERIALS, 2022, 15(12).

6. Changkun Li, Dewen Zhao, Jialin Wen, Xinchun Lu, Numerical investigation of wafer drying induced by the thermal Marangoni effect, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 132: 689-698.

7. Changkun Li, Dewen Zhao, Jialin Wen, Jie Cheng, Xinchun Lu, Evolution of entrained water film thickness and dynamics of Marangoni flow in Marangoni drying, RSC ADVANCES, 2018, 8(9): 4995-5004.

8. Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing, TRIBOLOGY INTERNATIONAL, 2017, 739: 75-80.

9. Dewen Zhao, Xinchun Lu, Chemical mechanical polishing: Theory and experiment, FRICTION, 2013, 1(4): 306-326. (Cover Paper)

10. Dewen Zhao, Tongqing Wang, Yongyong He, Xinchun Lu, Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGSEMICONDUCTOR MANUFACTURING, 2013, 16(4): 556-563.

11. Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Jianbin Luo, Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing, TRIBOLOGY INTERNATIONAL, 2013, 66: 330-336.

12. Dewen Zhao, Yongyong He, XinchunLu, In Situ Measurement of Fluid Pressure at the Wafer-Pad Interface during Chemical Mechanical Polishing of 12-inch Wafer, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 159(1): H22-H28.