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Jia Cheng

Jia Cheng

Associate Professor

Address: A1025, Lee Shau Kee Science and Technology Building, Department of Mechanical Engineering, Tsinghua University, Wudaokou, Haidian District, Beijing

Tel: (+86)010-62772209

Fax: (+86)010-62773470


Education background

2002-2008          Ph.D., Dept. of Precision Instruments & Mechanology, Tsinghua University, Beijing

(JinSong WANG, Yu ZHU, Ph.D. advisor)

Thesis Topic: Studies on Multi-fields Coupling Analysis and Optimization Design for Etch Process Chambers


1998-2002          A. B., Dept. of Mechanical Engineering, Tsinghua University, Beijing

Thesis Topic: Design of Battery Discharger for Electric Vehicle


2016/12-2018/01 Visiting scholar, Dept. of Materials Science and Engineering, Georgia Institute of Technology

2013/12-Present Associate professor, Dept. of Mechanical Engineering, Tsinghua University

2010/08-2012/12   Assistant Professor, Dept. of Precision Instruments and Mechanology, Tsinghua University,

2008/08-2010/08   Postdoctoral Fellow in the group of Prof. Dr. JI Linhong, Dept. of Precision Instruments and Mechanology, Tsinghua University

Teaching work

Undergraduate courses:

40130233                   Machine Sketching Practice

20130463/20120193      Fundamentals of Mechanical Design A(2)-Principles of Machinery

20120182                     Fundamentals of Mechanical Design B(3)-Mechanical Design

20120132                     Project of Machine Design

Areas of Research Interests/ Research Projects

Mechanical design theory and method

Multidisciplinary design optimization

Multi-field coupling simulation of IC equipment

Triboelectric microplasma

Biomedical engineering

Honors And Awards

2009      National Science and Technology Progress Award: 2nd Prize

2014      Young Teacher Teaching Competition: 1st Prize, Tsinghua University

2015      Outstanding Young Teacher Award, Tsinghua University- one of ten winners

2019      Outstanding Postgraduate Instructor, Tsinghua University

Academic Achievement


1.       Wang Z†, Shi Y†, Liu F, Wang H, Liu X, Sun R, Lu Y, Ji L, Wang ZL*, Cheng J*. 2020. Distributed mobile ultraviolet light sources driven by ambient mechanical stimuli. Nano Energy:104910. (IF=15.5)

2.       Wang K, Lu Y, Cheng J*, Zhu X, Ji L. 2020. Quantitative electrostatic force measurement and characterization based on oscillation amplitude using atomic force microscopy. AIP Advances 10:015143.

3.       Huo H†, Liu F†, Luo Y, Gu Q, Liu Y, Wang Z, Chen R, Ji L, Lu Y*, Yao R*, Cheng J*. 2020. Triboelectric nanogenerators for electro-assisted cell printing. Nano Energy 67:104150. (封底文章,IF=15.5)

4.       Cao M, Lu Y, Cheng J*, Ji L. 2020. Electrical description of an inductively coupled plasma processing reactor with discharge parameters calculated from a global model. AIP Advances 10:035216.

5.       Wu C†, Tetik H†, Cheng J†, Ding W, Guo H, Tao X, Zhou N, Zi Y, Wu Z, Wu H, Wang ZL*. 2019. Electrohydrodynamic jet printing driven by a triboelectric nanogenerator. Advanced Functional Materials 29:1901102. (IF=15.6)

6.       Ding W†, Zhou J†, Cheng J†, Wang Z, Guo H, Wu C, Xu S, Wu Z, Xie X*, Wang ZL*. 2019. TriboPump: a low‐cost, hand‐powered water disinfection system. Advanced Energy Materials 9:1901320. (IF=24.9)

7.       Liu F†, Liu Y†, Lu YJ, Wang ZZ, Shi YX, Ji LH*, Cheng J* "Electrical analysis of triboelectric nanogenerator for high voltage applications exampled by DBD microplasma." Nano Energy, 2019; 56: 482-493. (IF=15.5)

8.       Wang KS, Lu YJ, Cheng J*, Ji LH, Prediction of residual clamping force for Coulomb type and Johnsen–Rahbek type of bipolar electrostatic chucks. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2019; 233: 302-312.

9.       Cheng J, Ding WB, Zi YL, et al., "Triboelectric microplasma powered by mechanical stimuli," Nature Communications, 2018; 9: 3733. (IF=11.9)

10.    Wang KS, Cheng J, et al., A novel measuring method of clamping force for electrostatic chuck in semiconductor devices. Journal of Semiconductors, 2016. 37(4).

11.    Wang KS, Cheng J*, et al., Determination of electrostatic force and its characteristics based on phase difference by amplitude modulation atomic force microscopy. Nanoscale Research Letters, 2016. 11.

12.    Lu YJ, Ji LH, and Cheng J*, Simulation of Dual-Electrode Capacitively Coupled Plasma Discharges. Plasma Science & Technology, 2016. 18(12): p. 1175-1180.

13.    Cao ML, Lu YJ, Cheng J*, Ji LH. Electron heating enhancement due to plasma series resonance in a capacitively coupled RF discharge: Electrical modeling and comparison to experimental measurements. Japanese Journal of Applied Physics 2016; 55.

14.    Lin J, Hou YM, Cheng J, et al., Interactive Construction of Product Digital Model: The Recursive FBS Design Method and System Prototype. 2015 Advanced Design Concepts and Practice (Adcp 2015), 2016: p. 172-180.

15.    Sun Y, Cheng J, Lu Y, Ji L, Wang C. Investigation on thermal contact resistance of Si-wafer and electrostatic chuck. Chinese Journal of Vacuum Science and Technology 2016; 36(1). (in Chinese)

16.    Wang C, Cheng J, Lu Y, Ji L. Effect of showerhead hole structure on flow-field in large sized chemical vapor deposition reactor. Chinese Journal of Vacuum Science and Technology 2015; 35(11). (in Chinese)

17.    Wang C, Cheng J, Ji L, Lu Y, Sun Y, Lin J. 2-D DSMC algorithm based on Delaunay triangles.Qinghua Daxue Xuebao/Journal of Tsinghua University 2015;55:1079-86,97. (in Chinese)

18.    Sun Y, Cheng J, Lu Y, Hou Y, Ji L. Design space of electrostatic chuck in etching chamber. Journal of Semiconductors 2015;36.

19.    Sun Y, Cheng J, Lu Y, Hou Y, Ji L. Factors influcing rarefied gas heat transfer between a wafer and an electrostatic chuck. Qinghua Daxue Xuebao/Journal of Tsinghua University 2015;55:756-60.

20.    Wang XK, Cheng J, Wang KS, Yang YY, Sun YC, Cao ML, et al. Modeling of electrostatic chuck and simulation of electrostatic force.  2013 International Conference on Sensors, Mechatronics and Automation, ICSMA 2013, December 24, 2013 - December 25, 2013. Shenzhen, China: Trans Tech Publications; 2014. p. 588-94.

21.    Wang X, Cheng J, Wang K, Yang Y, Sun Y, Cao M, et al. Finite element analysis on factors influencing the clamping force in an electrostatic chuck. Journal of Semiconductors 2014;35.

22.    Cao ML, Cheng J, Han CK, Ji LH. The current status of development and applications of wave-heated discharge plasma sources.  4th International Conference on Advanced Engineering Materials and Technology, AEMT 2014, June 14, 2014 - June 15, 2014. Xiamen, China: Trans Tech Publications Ltd; 2014. p. 193-9.

23.    Cheng J, Ji L, Wang K, Han C, Shi Y. Two-dimensional simulation of inductively coupled plasma based on COMSOL and comparison with experimental data. Journal of Semiconductors 2013;34.

24.    Hao D, Cheng J, Ji L, Sun Y. Simulation of cold plasma in a chamber under high- and low-frequency voltage conditions for a capacitively coupled plasma. Journal of Semiconductors 2012;33.

25.    Cheng J, Zhu Y, Ji L. Modeling approach and analysis of the structural parameters of an inductively coupled plasma etcher based on a regression orthogonal design. Plasma Science and Technology 2012;14:1059-68.

26.    Cheng J, Ji L, Zhu Y, Shi Y. Fluid model of inductively coupled plasma etcher based on COMSOL. Journal of Semiconductors 2010;31.

27.    Cheng J, Ji L, Zhu Y. Two-dimensional model and experimental comparison of an inductively coupled plasma. Qinghua Daxue Xuebao/Journal of Tsinghua University 2010;50:250-3. (in Chinese)

28.    Cheng J, Zhu Y, Duan G, Wang C. Analysis of processing chamber flow field characteristics for an ICP etcher based on regression orthogonal design. Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors 2008;29:780-784. (in Chinese)

29.    Cheng J, Zhu Y, Wang J. Two-dimensional discharge simulation of inductively coupled plasma etcher. Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors 2007;28:989-994. (in Chinese)

30.    Cheng J, Zhu Y, Duan G, Chen Y. Three-dimensional discharge simulation of inductively coupled plasma etcher.  International Conference on Integration and Commercialization of Micro and Nanosystems 2007, January 10, 2007 - January 13, 2007. Sanya, Hainan, China: American Society of Mechanical Engineers; 2007. p. 795-800.

31.    Cheng J, Zhu Y. Influence of configurations of chamber and coil on uniformity of plasma distribution for inductively coupled plasma etcher.  International Technology and Innovation Conference 2006, ITIC 2006, November 6, 2006 - November 7, 2006. 524 ed. Hangzhou, China: Institution of Engineering and Technology; 2006. p. 1113-7.



1.       CN Patent No. ZL201910514579.6: “An ultraviolet water sterilization device that uses friction to generate electricity”,issued to Cheng Jia, Wang Zhaozheng, Sun Runtong, Ji Linhong, Lu Yijia. filed June 04,2020.

2.       CN Patent No. ZL201910514573.9: “An ultraviolet water sterilization device based on triboelectricity generation”,issued to Cheng Jia, Wang Zhaozheng, Sun Runtong, Ji Linhong, Lu Yijia. filed June 05,2020.

3.       CN Patent No. ZL201910514563.5: “Micro-plasma generation device based on triboelectricity and automatic energy gas sensor”,issued to Cheng Jia, Wang Yiqun, Liu Fan, Xiong Chengsong, Ji Linhong, Lu Yijia,filed April 29,2020.

4.       CN Patent No. CN201410310128.8: “Electromagnetic induction heating device with adjustable radial distribution of thermal power density”,issued to Cheng Jia,Cao Zili,Ji Linhong,Wu Xiaojing,Lu YIjia,Zhang Ke,Zhou Jinghui,filed September 17,2014.

5.       CN Patent No. ZL201310397381.7: “A Manual portable lifting device”,issued to Cheng Jia,Lin Jia,Ji Linhong,Fang Yongcong,Zheng Feng,Su Can,filed April 20,2016.

6.       CN Patent No. ZL201510743907.1: “Detection System and Method for Electrostatic Force of Electrostatic Chuck”,issued to Cheng Jia,Wang Kecheng,Zhang Junbin,Wang Jianchong,Zhong Yin,Lu Yijia,Ji Linhong,September 22,2017.

7.       CN Patent No. ZL201310251181.0: “Device for Measuring Electrostatic Force of Electrostatic Chuck”,issued to Cheng Jia,Cao Minglu,Ji Linhong,October 28,2015.

8.       CN Patent No. ZL201210016664.8: “Variable Structured Vacuum Chamber for Internal Rarefied Gas Flow Simulation Validation and Pressure Detection”,issued to Cheng Jia,Wang Rencheng,Ji Linhong,Liu Weifeng,Wang Chuncai,Lin JIa,Sun Yuchun,Hao Daoxin,July 23,2014.



1.       Registration No. 2017SR734984: “Control Software for Rat Weight Loss Rehabilitation Training Platform”,issued to Cheng Jia,Liu Fan,Zhang Yihe,Huo Hengning.

2.       Registration No. 2016SR179283: “Mechanism Motion Design Software”,issued to Cheng Jia,Xia Zenghua,Chen Daiwei.

3.       Registration No. 2015SR121192:“Two Dimensional Parallel Computing Software Based on Unstructured Grid Direct Simulation Monte Carlo”,issued to Cheng Jia,Wang Chuncai,Lu Yijia,Ji Linhong.

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