Ph.D., Institute of Metal Research, the Chinese Academy of Sciences, 1994.3
M.S., Jilin University of Technology, 1991.1
B.S., Jilin University of Technology, 1988.7
Department of Mechanical Engineering, Tsinghua University, Research fellow, 2013-Present, full time
Department of Precision Instrument, Tsinghua University, Research fellow, 2003.1-2012.12, full time
Department of Precision Instrument, Tsinghua University, Associate research fellow, 1996.4-2002.12, full time
Tsinghua University, Post-doctor, Lecturer, 1994.4-1996.3, full time
Cheung Kong Scholar Chair Professor (2009)
National Science Fund for Distinguished Young Scholars (2008)
1st-Class China University in Natural Sciences (2010)
2nd-Class National Progress Awards (2008)
1st-Class China University in Natural Sciences (2001)
3rd-Class Natural Sciences Award of Chinese Academy of Sciences (1998)
[1] Hegeng Mei, Xinchun Lu, The quantitative description between zeta potential and fluorescent particle adsorption on Cu surface, SURFACE AND INTERFACE ANALYSIS, 46(2014), 56-60
[2] Zhimin Chai, Yuhong Liu, Xinchun Lu, Dannong He, Reducing Adhesion Force by Means of Atomic Layer Deposition of ZnO Films with Nanoscale Surface Roughness, ACS APPLIED MATERIALS & INTERFACES, 6(2014), 3325-3330
[3] Zhimin Chai, Yuhong Liu, Xinchun Lu, Dannong He, Nanotribological Behavior of Ultra-thin Al2O3 Films Prepared by Atomic Layer Deposition, TRIBOLOGY LETTERS, 55(2014), 143-149
[4] Jing Li, Yuhong Liu, Yuanjing Dai, Dachuan Yue, Xinchun Lu, Jianbin Luo, Achievement of a near-perfect smooth silicon surface, SCIENCE CHINA TECHNOLOGICAL SCIENCES, 56(2013),2847-2853
[5] Tongqing Wang, Xinchun Lu, Dewen Zhao, Yongyong He, Jianbin Luo, Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer, MICROELECTRONIC ENGINEERING, 112(2013), 5-9
[6] Jing Li, Yuhong Liu, Xinchun Lu, Jianbin Luo, Yuanjing Dai, Material Removal Mechanism of Copper CMP from a Chemical–Mechanical Synergy Perspective, TRIBOLOGY LETTERS, 49(2013), 11-19
[7] Hongkai Li, Zilian Qu, Qian Zhao, Fangxin Tian, Dewen Zhao, Yonggang Meng, Xinchun Lu, A reliable control system for measurement on film thickness in copper chemical mechanical planarization system, REVIEW OF SCIENTIFIC INSTRUMENTS, 84(2013), 125101
[8] Guiquan Han, Yuhong Liu, Xinchun Lu, Jianbin Luo, A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials, NANOSCALE RESEARCH LETTERS, 7(2012),1-5
[9] Yan Pan, Yuhong Liu, Xinchun Lu, Guoshun Pan, Jianbin Luo, The Role of Hydroxyethyl Cellulose (HEC) in the Chemical Mechanical Planarization of Copper, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 159(2012), H329-H334
[10] Zhimin Chai, Xinchun Lu, Dannong He, Atomic Layer Deposition of Zinc Oxide Films: Effects of Nanocrystalline Characteristics on Tribological Performance, SURFACE & COATINGS TECHNOLOGY, 207(2012), 361-366
[11] Dewen Zhao, Yongyong He, Xinchun Lu, In situ measurement of fluid pressure at the wafer-pad interface during chemical mechanical polishing of 12-inch wafer, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 159(2011), H22-H28
[12] Yating Huang, Dan Guo, Xinchun Lu, Jianbin Luo, Modeling of particle removal processes in brush scrubber cleaning, WEAR, 273(2011), 105-110
